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Jiangsu Changdian Technology is a leading global provider of integrated circuit manufacturing and technical services, providing a comprehensive one-stop service for chip product manufacturing, including system integration, design simulation, technical development, product certification, wafer testing, wafer level mid channel packaging testing, system level packaging testing, chip product testing, and providing direct shipping services to semiconductor customers around the world. Our main products include finished products (discrete devices, power management ICs) and wafers, covering diodes, transistors, MOSFETs, IGBT single transistors/modules, third-generation semiconductors, as well as power management ICs represented by LDO, DC-DC, and lithium battery protection. Related products can meet consumer grade, industrial grade, and vehicle specification standards, supporting customers' one-stop procurement needs. Through high integration wafer level packaging (WLP), 2.5D/3D packaging, system level packaging (SiP), high-performance flip chip packaging, and advanced wire bonding technology, Changdian Technology's products, services, and technologies cover mainstream integrated circuit system applications, including network communication, mobile terminals, high-performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, industrial intelligence, and other fields. Changdian Technology has six production bases and two research and development centers in China, South Korea, and Singapore, and has business institutions in over 20 countries and regions. It can closely cooperate with global customers and provide efficient industrial chain support.
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