Model selection list and online purchase address for the RM series of alloy chip resistors: click on the image to enter
This article focuses on a comprehensive introduction to the parameters and performance of the RM series of Lizhi LIZ alloy chip resistors:
The RM series of alloy chip resistors have the following characteristics:
1. Excellent resistance temperature coefficient
2. Excellent ground temperature electromotive potential energy
3. Meet RoHS and halogen-free requirements
4. The protective layer material meets the UL-94-V0 flame resistance level
The RM series of alloy chip resistors are applied as follows:
1. Power supply unit
2. Laptop computer
3. Automotive Electronics
4. Battery charger
Lizhi LIZ brand alloy patch resistor RM series material number Naming convention are as follows:
| RM | 2512 | F | B | R010 | G | M |
| Type | Size | Tolerance | Rated Power | Resistance Value | Packing Code | Material |
The characteristics of the Lizhi LIZ alloy chip resistor RM series electrical appliances are as follows:
| Type | RM2512 |
| Rated Power | 3W |
| Temperature Characteristic TCR/（ppm/℃） | ＋25℃~＋125℃：±50ppm |
| ＋25℃~＋155℃：±65ppm | |
| Dielectric Strength | ＞100mΩ |
| Temperature operating range | -55℃~＋155℃ |
| Resistance accuracy range 1%，2%，5% | 1mΩ~10mΩ |
Lizhi LIZ alloy chip resistor overall dimensions:
| Type | RM2512 | |
| Size | L(mm) | 6.40±0.20 |
| W(mm) | 3.20±0.20 | |
| T(mm) | 0.6±0.20 | |
| E(mm) | 2.00±0.20(R≤2mΩ) | |
| 0.90±0.20(R＞2mΩ) | ||
The resistance performance parameters of Lizhi LIZ alloy chip are as follows:
| Ltem | Test Methods | Specification Limits |
| Temperature coefficient | IEC60115-1 4.8 | As Spec.＋25℃~＋125℃：±50ppm/℃ ＋25℃~＋155℃：±65ppm/℃ |
| High temperature storage | MIL-STD-202 Method 108 | ＜±1% |
| Low temperature storage | IEC60115-1 4.23.4 | ＜±0.5% |
| Temperature cycling | JESD22 Method JA-104 | ＜±0.5% |
| Short term overload | IEC60115-1 4.13 | ＜±0.5% |
| Moisture resistance characteristics | MIL-STD-202 Method 103 | ＜±0.5% |
| Load life | MIL-STD-202 Method 108 | ＜±1% |
| solderability | J-STD-200B test B | 最少95%面积上锡 |
| Resistance to soldering heat | IEC60115-1 4.18 | ＜±0.5% |
| Mechanical shock | MIL-STD-202 Method 213 | ＜±0.5% |
| Vibration resistance | MIL-STD-202 Method 204 | ＜±0.5% |
| Terminal bending | IEC 60115-1-4.33 | ＜±0.5% |
| Terminal Strength | IEC 60115-1-4.32 | ＜±0.5% |
| Thermal Shock | MIL-STD-202 Method 107 | ＜±0.5% |
| Flame retardancy | UL-94 | / |
| ESD test | AEC-Q200-002 | ＜±1% |
