Model selection list and online purchase address for the RM series of alloy chip resistors: click on the image to enter
This article focuses on a comprehensive introduction to the parameters and performance of the AM series of Lizhi LIZ alloy chip resistors:
The RM series of alloy chip resistors have the following characteristics:
1. Excellent resistance temperature coefficient
2. Excellent ground temperature electromotive potential energy
3. Meet RoHS and halogen-free requirements
4. The protective layer material meets the UL-94-V0 flame resistance level
The AM series of alloy chip resistors are applied as follows:
1. Power supply unit
2. Laptop computer
3. Automotive Electronics
4. Battery charger
5.Battery protection board
6.inverter
7.Telecommunication equipment
The Naming convention of the material number of the AZ LIZ brand alloy patch resistor AM series is as follows:
| AM | 2512 | F | B | R010 | G | M |
| Type | Size | Tolerance | Rated Power | Resistance Value | Packing Code | Material |
The electrical characteristics of the Lizhi LIZ car gauge alloy SMD resistor AM series are as follows:
| Type | AM1206 | AM2512 |
| Rated Power | 1/2W、1W | 1W、1.5W、2W |
| Temperature Characteristic TCR/（ppm/℃） | ＋25℃~＋125℃：±50ppm | ＋25℃~＋125℃：±50ppm |
| ＋25℃~＋155℃：±65ppm | ＋25℃~＋155℃：±65ppm | |
| Dielectric Strength | ＞100mΩ | ＞100mΩ |
| Temperature operating range | -55℃~＋155℃ | -55℃~＋155℃ |
| Resistance accuracy range 1%，2%，5% | 1mΩ~50mΩ | 1mΩ~100mΩ |
Lizhi LIZ car gauge alloy chip resistor AM overall dimensions:
| Type | RM1206 | RM2512 | |
| Size | L(mm) | 3.20±0.20 | 6.40±0.20 |
| W(mm) | 1.60±0.20 | 3.20±0.20 | |
| T(mm) | 0.6±0.20(2mΩ≤R≤50mΩ) | 0.6±0.20 | |
| E(mm) | 0.5±0.20(2mΩ≤R≤50mΩ) | 2.00±0.20(R≤2mΩ) | |
| 0.90±0.20(R＞2mΩ) | |||
The performance parameters of the Lizhi LIZ car gauge alloy chip resistor AM series are as follows:
| Ltem | Test Methods | Specification Limits |
| Temperature coefficient | IEC60115-1 4.8 | As Spec.＋25℃~＋125℃：±50ppm/℃ ＋25℃~＋155℃：±65ppm/℃ |
| High temperature storage | MIL-STD-202 Method 108 | ＜±1% |
| Low temperature storage | IEC60115-1 4.23.4 | ＜±0.5% |
| Temperature cycling | JESD22 Method JA-104 | ＜±0.5% |
| Short term overload | IEC60115-1 4.13 | ＜±0.5% |
| Moisture resistance characteristics | MIL-STD-202 Method 103 | ＜±0.5% |
| Load life | MIL-STD-202 Method 108 | ＜±1% |
| solderability | J-STD-200B test B | Min 95%coverage |
| Resistance to soldering heat | IEC60115-1 4.18 | ＜±0.5% |
| Mechanical shock | MIL-STD-202 Method 213 | ＜±0.5% |
| Vibration resistance | MIL-STD-202 Method 204 | ＜±0.5% |
| Terminal bending | IEC 60115-1-4.33 | ＜±0.5% |
| Terminal Strength | IEC 60115-1-4.32 | ＜±0.5% |
| Thermal Shock | MIL-STD-202 Method 107 | ＜±0.5% |
| Flame retardancy | UL-94 | / |
| ESD test | IEC 61000-4-2 | ＜±1% |
